Thick wafer-silicon is the dominant solar cell technology. It is of great interest to develop ultra-thin solar cells that can reduce materials usage, but still achieve acceptable performance and high solar absorption. Accordingly, we developed a highly absorbing ultra-thin crystalline Si based solar cell architecture using periodically patterned front and rear dielectric nanocone arrays which p...

This paper explores the feasibility of constructing an autonomous sensor array on a standard silicon wafer. Such a sensor-wafer would include integrated electronics, power, and communications, and would be capable of being placed into a standard production process step, or short sequence of steps. During the processing of the sensor-wafer, various process parameters would be measured and record...

We report on a hybrid InP/Si photonic crystal nanobeam laser emitting at 1578 nm with a low threshold power of ~14.7 μW. Laser gain is provided from a single InAsP quantum well embedded in a 155 nm InP layer bonded on a standard silicon-on-insulator wafer. This miniaturized nanolaser, with an extremely small modal volume of 0.375(λ/n)(3), is a promising and efficient light source for silicon ph...

With an aim of ultra-low power operation, membranetype distributed-feedback (DFB) lasers consisting of wirelike active regions are realized with an InP-based high index-contrast waveguide by using benzocyclobutene (BCB) as well as direct boding on a silicon-on-insulator (SOI) substrate. Lateral current injection (LCI) type lasers on a semi-insulating (SI) InP substrate are also presented. Keywo...

Heterogeneously integrated III-V-on-silicon second-order distributed feedback lasers utilizing an ultra-thin DVS-BCB die-to-wafer bonding process are reported. A novel DFB laser design exploiting high confinement in the active waveguide is demonstrated. A 14 mW single-facet output power coupled to a silicon waveguide, 50 dB side-mode suppression ratio and continuous wave operation up to 60°C ar...

Through-wafer electrical interconnection is a critical technology for advanced packaging. In this paper, a novel capillary-effect-based solder pump has been proposed and analyzed, which could produce interconnects through and between silicon dies. The principle of this pump is to use the surface tension of a molten solder, introduced in the form of balls, to drive sufficient material into a dee...

Thin films of lithium niobate are wafer bonded onto silicon substrates and rib-loaded with a chalcogenide glass, Ge(23)Sb(7)S(70), to demonstrate strongly confined single-mode submicron waveguides, microring modulators, and Mach-Zehnder modulators in the telecom C band. The 200 μm radii microring modulators present 1.2 dB/cm waveguide propagation loss, 1.2 × 10(5) quality factor, 0.4 GHz/V tuni...

Porous layers were produced on a p-type (100) Si wafer by electrochemical anodic etching. The morphological, nanostructural and optical features of the porous Si were investigated as functions of the etching conditions. As the wafer resistivity was increased from 0.005 to 15 Ω·cm, the etched region exhibited 'sponge', 'mountain' and 'column'-type morphologies. Among them, the sponge-type struct...

We report an electrohydrodynamic effect arising from the application of alternating electric fields to patterned electrode surfaces. The AC fields were applied to dilute suspensions of latex microspheres enclosed between a patterned silicon wafer and an ITO-coated glass slide in a small chamber. The latex particles became collected in the center of the conductive "corrals" on the silicon wafer ...

On the surface of mesoporous silica thin films (MSTF) which were fabricated by sol-gel approach there are existences of water and three different silanol types including chained, germinal and isolated silanol. Their amounts changes as a function of aging time of used sol solution, as confirmed by FT-IR. The adsorbed water generates ionic carriers such as H+ and OHand passivates the Si dangling ...