In this paper, a new specimen called mixed mode double cantilever beam (MMDCB) was developed for the fracture characterization of adhesives under high displacement rates. The MMDCB designed using finite elements simulations in order to determine toughness mixity plane I+II+III. Firstly, results from specimens tested quasi-static loading were experimentally compared reference single leg bending ...

A series of 18 Ni (300 grade) maraging steels of overall commercial purity but containing also deliberate impurity additions of sulphur, phosphorus, carbon, chromium and silicon + manganese has been studied. The fracture toughness and stress-corrosion resistance (determined using planestrain fatigue-precracked specimens tested in 3. 5% sodium chloride solution) of these steels have been compare...

Interface reliability issue has become a major concern in developing flip chip assembly. The CTE mismatch between different material layers may induce severe interface delamination reliability problem. In this study, multifunctional micro-moiré interferometry (MI) system was utilized to study the interfacial response of flip chip assembly under accelerated thermal cycling (ATC) in the temperatu...

A mechanical model for the prediction of mode I delamination failure of a laminated double cantilever beam (DCB) type specimen is presented. The volume of material ahead of the crack tip that experiences high stresses due to the presence of the crack tip was replaced by a nonlinear elastic spring foundation. The volume undergoing global deformation due to the external loading was replaced by a ...

Degradation of cleavage fracture toughness for low carbon steels due to pre-straining and irradiation was investigated on the basis of the local fracture criterion approach. Formulation of cleavage fracture toughness through the statistical modelling proposed by BEREMIN has been simplified by the present authors to the expression involving yield stress and cleavage fracture stress of materials....

Electric tields can mtluence the fracture toughness offerroelectrics. For example, poled ferroelectrrcs cxhtbit fracture toughness anisotropy : the material is tougher for a crack parallel to the poling direction but less tough for a crack perpendicular to it. When an electric field is applied to a poled sample. a positive field reduces its fracture toughness but a negative field enhances it. P...