Yield is one of the most important factors for massive semiconductor circuits production. As process variation tolerances decrease and the number of contacts/vias increase in modern technologies, contact/via failure has increased substantially, which attracts many attentions from both manufacture and design domains. Among all the contact/via failure mechanisms, lithography related ones become m...

Packaging costs of Micro-Electro-Mechanical System (MEMS) are still contributing with >50% to the total costs of most devices. Aligned wafer bonding techniques for Wafer-level packaging (WLP) demonstrates a huge potential to reduce these costs due to a smaller size of the total package, improved performance and shorter time to market. A special group of MEMS devices, Micro-OptoElectro-Mechanica...

The modelling, simulation, fabrication and testing of a microchannel cooling plate are described in this article. The cooling component is to be used in microelectronic packaging applications. The nickelbased micro-channel cooling plate is fabricated on a glass substrate using a two-layer electroforming process borrowed from UV-LIGA. Forced convection of air or liquid is scheduled for this micr...

The food packaging industries have got a problem of deterioration of sterilized food due to the attack of micro organism. This is due to the re-contamination of the food during packaging process. The recontamination after packaging can be avoided by sterilizing the packed foods. This will help to increase the shelf life of the food by killing the micro organism. Sterilization of the packed food...

The problem of concurrent thermal and vibration loading has not been thoroughly studied even though it is common in electronic packaging applications. Here we attempt to address such a problem using a damage mechanics based constitutive model. Damage mechanics constitutive model for eutectic Pb/Sn solder alloys is used to simulate the damage effects of concurrent cyclic thermal loads and vibrat...

The expending development of wireless communication requires strong demands for components with improved capabilities. RF MEMS devices offer a variable alternative to conventional communication components because they consume less DC power, have lower losses, higher linearity and higher Q factor. However, the commercialization of RF MEMS devices is hindered by technological issues such as their...

For five decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in miniaturization of electronics products—Moore’s Law. Now, scaling hits a brick wall, a paradigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or a.k.a “More than Moore”. This paper presents pack...

Many downhole instrumentation tools manufacture today utilizing organic material packaging technology for producing electronic modules. Such approach with organic PCB, standard packaged discrete semiconductor and SMT-type passive components has limited the device operating temperature range in 177oC area. An alternative packaging approach is to utilize Hybrid Microelectronics Technology to incr...