We present a new model for dishing and erosion during chemical-mechanical planarization. According to this model, dishing and erosion is controlled by the local pressure distribution between features on the wafer and the polishing pad. The model uses a contact mechanics analysis based on the work by Greenwood to evaluate the pressure distribution taking into account the compliance of the pad as...

Adhesion of micro-organisms to resin surface may be caused by inadequate polishing. Most of the studies published in literature are relative to manually prepared samples and do not take into account that test repeatability is not guaranteed a priori since skills may change from one operator to another and the quality of the work done by the same expert operator may depend on "human" factors suc...

This investigation was conducted to ascertain the benefits of electropolishing after mechanical polishing for electron backscattered diffraction of a Ti 2 AlNb intermetallic Ti − 21Al − 29Nb (at.%) alloy containing the orthorhombic (O) and body-centered-cubic (BCC) phases. Electropolishing was performed at − 40 ° C in 6% H 2 SO 4 methanol solution. Atomic force microscopy was used to measure th...

This study discusses the improvement of surface finish of medium or large holes beyond traditional drilling, boring, rough turning, or extruding by electrochemical smoothing using inserted rib-plate electrodes. High electrical current is not required when the rib plate is used to reduce the engaged area for large hole. Traditionally, the hole polishing requires a sequence of complicated premach...

OBJECTIVE To assess the surface roughness resulting after application of currently available interproximal polishing. MATERIALS AND METHODS The analysis was carried out by means of digital subtraction radiography, profilometry, and scanning electron microscopy. The roughness of natural untreated enamel served as the reference. Five enamel reduction methods were tested (Profin, New Metal Strip...

AIM The objective was to determine clinical and microbiological effects and perceived treatment discomfort of root debridement by subgingival air polishing compared with ultrasonic instrumentation during supportive periodontal therapy (SPT). MATERIAL AND METHODS The trial was conducted as a split-mouth designed study of 2-month duration including 20 recall patients previously treated for chro...

Currently, many medical devices are made of implantable metals such as 316LVM stainless steel. Electropolishing is a common process to obtain a smooth surface, free of contaminants and more passive, which allows for minimizing the foreign body response and cell adhesion. However, polishing of small implants with a highly complicated geometry and nonuniform metallurgy might result in unsatisfact...

As device sizes are scaled to sub-micron dimensions, planarization technology becomes increasingly important, both for bipolar and CMOS trench isolation and for multi-level interconnects and wiring. Although chemi-mechanical polishing (CMP) has been used extensively in silicon technology for wafer preparation[l,2], it is only recently that CMP has emerged as a new technique for achieving a high...