In the search for sustainable and ecological alternatives in food packaging, use of starch as one most abundant biopolymer resources to formulate edible films has been studied. Nonetheless, compatibility with other derivatives, such dextrin and/or chemically modified starch, not explored yet. The objective this research was characterize opacity, water vapor barrier capability, thermal propertie...

this paper reviews the possible effects determined on polymeric food packaging films by the simultaneous application of pressure (p) and temperature (t) in high pressure pasteurization and sterilization treatments of packaged foodstuffs. both theoretical modeling and experimental issues are discussed. in fact reversible and irreversible effects that could occur in single film as well as in mult...

Shape memory alloy (SMA) based actuators have the potential to be lower mass, more compact, and more simplistic than conventional based actuators (electrical, hydraulic, etc); however, one of the key issues that plagues their broad use is packaging since long lengths of wire are often necessary to achieve reasonable actuation strokes. Spooling the wire around pulleys or mandrels is one approach...

BACKGROUND This study aimed to estimate the effect of the season of milk production and the packaging method on sensory characteristics and some physicochemical indices of fresh curd cheese stored in cooling conditions. MATERIAL AND METHODS This study covered three seasons: autumn (October), winter (January) and spring (March/April). The experimental samples were vacuum packed in 50 or 100 μm...

Packaging protects food products from environmental influences, assuring quality and safety throughout shelf life if properly performed. Packaging quality depends on the quality of the packaging material and of the closure or seal. A common problem possibly jeopardizing seal quality is the presence of seal contamination, which can cause a decreased seal strength, an increased packaging failure ...

this review focuses on the introduction of par-baked bread technology and effects of map on the microbial and sensorial shelf life of the mentioned bread, which are discussed here under four categories of the product contamination after probating, the composition of the gas, the characteristics of the packaging material, and the packaging technology. since traditional breads have a low quality ...

Demand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. They range from purely empirical to mechanism based models where dislocation motion and diffusion processes are taken into account. In this study, most commonly used creep models are compared with the...

Thermal resistance is a key technical index which indicates the thermal management of multi-chip module high power LED (MCM-LED) packaging heat dissipation system. In this paper, the prototype structure of MCM-LED packaging heat dissipation system is proposed to study the reliable thermal resistance calculation method. In order to analyze the total thermal resistance of the MCM-LED packaging he...

The increasing demand for feature content of portable electronic products drives requirements for smaller volume and lower cost device packaging. This has, in turn, led to the packaging industry’s interest in stacked chip technology, especially for memory applications. The growth of stacked chip package technology drove development of specific die adhesives that combine low cost with controlled...

Deflection behavior of several encapsulant materials under uniform pressure was studied to determine the best encapsulant for MEMS device. Encapsulation is needed to protect movable parts of MEMS devices during high pressure transfer molded packaging process. The selected encapsulant material has to have surface deflection of less than 5 μm under 100 atm vertical loading. Deflection was simulat...