Abstract Benefitted from progress on the large-diameter Ga 2 O 3 wafers and processing techniques, power device technology has witnessed fast advances toward electronics applications. Recently, reports large-area (ampere-class) devices have emerged globally, scope of these works gone well beyond bare-die demonstration into packaging, circuit testing, ruggedness evaluation. These results placed ...

Sintering of nano Ag paste on bare Cu has attracted more interests recently for high-temperature electronics packaging, which offers the advantages high reliability, cost-effective and direct bonding process. However, current methods normally need a protective atmosphere or metallization substrate to avoid oxidation. In this study, self-assembled monolayers (SAMs) were deposited suppress oxidat...

plastics are well-established for convenient and safe packaging and distribution of food and feed goods. at present, this special sector of the plastic market displays remarkably increasing quantities of its annual production. caused by the ongoing limitation and strongly fluctuating prices of fossil feedstocks, classically used for plastic production, there is an evident trend to switch toward...

Paper and board are widely used as food packaging materials, mainly for disposable products. As public interest in conservation of natural resources has accelerated in the past several years, the use of recycled paper and board has increased. Recycled fiber materials can be used in certain limits as food contact materials. The safety of recycled fiber-based materials for food contact applicatio...

The MIT Microengine Project is an ongoing effort to build a MEMS based gas turbine engine and turbogenerator. This thesis covers the development and testing of the packaging needed for the microengine and related devices. The packaging of the microengine includes the fluidic, electrical, and sensor connections that interface the engine with the supplies and instruments necessary for operation. ...

As the semiconductor industry continues to move towards higher pin count, finer pitch, multi-row and multistack devices, wire bonding becomes an increasing challenge for today’s advanced packaging processes. Insulated bonding wire technology, known as X-WireTM, has been identified on the 2006 ITRS Roadmap for Semiconductors [1], as a viable, cost-effective solution to enable complex package des...

Increasing environmental concerns and pending government regulations have pressured microelectronic manufacturers to find suitable alternatives to Pb-bearing solders traditionally used in electronics packaging. Over recent years, Sn-rich solders have received significant attention as suitable replacements for Pbbearing solders. Understanding the behavior of intermetallics in Sn-rich solders is ...

A view of modern electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protecti...