Gate dielectric leakage current becomes a serious concern as sub-20Å gate oxide prevails in advanced CMOS processes. Oxide this thin can conduct significant leakage current by various direct-tunneling mechanisms and degrade circuit performance. While the gate leakage current of MOS capacitors has been much studied, little has been reported on compact MOSFET modeling with gate leakage. In this w...

As transistor dimensions are scaled down in accordance with Moore's Law to provide for improved performance and cost per function, variability in transistor performance grows in significance and can present a major challenge for achieving high yield in the manufacture of integrated circuits utilizing transistors with sub-30 nm gate lengths. Increased variability in the threshold voltage (V T) o...

This paper describes integration of an advanced composite high-K gate stack (4nm TaSiOx-2nm InP) in the In0.7Ga0.3As quantum-well field effect transistor (QWFET) on silicon substrate. The composite high-K gate stack enables both (i) thin electrical oxide thickness (tOXE) and low gate leakage (JG) and (ii) effective carrier confinement and high effective carrier velocity (Veff) in the QW channel...

LNA, the author stated that there were other sources of noise outside of the amplifier that added to the noise figure, such as board parasitics as well as noisy bias components. The author further stated that the prediction of the model presented here is similar to the noise figures presented in similar CMOS LNA's.[4] IV. Conclusion A complete model for the drain current noise for MOSFET device...

We have fabricated 30 nm In0.7Ga0.3As Inverted-Type HEMTs with outstanding logic performance, scalability and high frequency characteristics. The motivation for this work is the demonstration of reduced gate leakage current in the Inverted HEMT structure. The fabricated devices show excellent Lg scalability down to 30 nm. Lg = 30 nm devices have been fabricated with exhibit gm = 1.27 mS/μm, S =...

The low power consumption and good speed has become an important issues in the minds of consumers as electronic items are increasing in every houses, everyday. VLSI has been very successful in this aspect as new and new technologies are been developed in VLSI, which has lead, a solution to the above problem. DG MOSFET, proposed in 1984 as “XMOS” by ETL is the most promising and leading contende...

FinFET devices are comprehensively investigated owing to the projection for application in the CMOS integrated circuits fabrication. Deducing MOSFET size have great influence on electrostatic characteristic.The indiscriminate variations of the characteristics lead to a divergence effect which is imperative from the point of view of design and manufacture. In this paper different types of the po...

In this article, a new structure is presented for MOS (Metal Oxide Semiconductor)-like junctionless carbon nanotube field effect transistor (MOS-like J-CNTFET), in which dual material gate with different work-functions are used. In the aforementioned structure, the size of the gates near the source and the drain are 14 and 6 nm, respectively, and the work-functions are equal and 0.5 eV less tha...

In this article, a new structure is presented for MOS (Metal Oxide Semiconductor)-like junctionless carbon nanotube field effect transistor (MOS-like J-CNTFET), in which dual material gate with different work-functions are used. In the aforementioned structure, the size of the gates near the source and the drain are 14 and 6 nm, respectively, and the work-functions are equal and 0.5 eV less tha...