A new, oxygen-stabilized intermetallic compound was identified in sintered, pre-alloyed rare-earth iron powder samples. Its composition corresponds to formula R.-Fe^Oj, and its crystal structure belongs to space group Imjnu The presence of these compounds has been observed, so far, in several K-Fe-0 systems, with R = Gd, Tb, Dy, Ho* Er and Y.

In this experiment, a Sn35Bi0.3Ag–xIn (x = 0, 0.5, 1.0, 1.5) alloy solder was prepared by electromagnetic induction heating furnace. The effects of on the thermodynamic properties, wettability, interface microstructure, and soldering performance Sn35Bi0.3Ag–xIn/Cu joints were studied synchrotron thermal analyzer (DSC), contact-angle measuring instrument, scanning electron microscope (SEM), ener...

Al/Cu dissimilar joining is a key technology for reducing the weight and cost of electrical components. In this study, friction stir lap welding (FSLW) Ni-containing Al alloy to pure Cu was performed, effects addition Ni on weld strength interfacial microstructure were examined. A thin intermetallic compound (IMC) layer observed at interface produced by FSLW. The 3 at.% effectively improved str...

To study the micromorphology and dynamic evolution law of copper aluminum composite interface evolution, ultra-high temperature laser Confocal microscopy (CLSM) was used to observe analyze in situ, then SEM, EDS other advanced material analysis methods were layer, composition layer formation process interface. The results indicate that is mainly related mutual diffusion atoms reaction between a...

Due to the consideration of environmental protection policy, all electronic products are requested to be lead free. In package field, solder ball is also requested to be lead free and currently the most popular type of solder ball is the Sn/Ag/Cu solder [1]. Sn/Ag/Cu solder has higher melting point and weaker wettability [2-3] during IR re-flow profile than eutectic solder ( Sn/Pb ), therefore ...

Leaded solder ball was replaced by leadfree solder ball which is now widely used in semiconductor industries, due to the hazardous effects of lead to human’s health and toxicity for environment. Due to this, poor solder joint strength for Ball Grid Array (BGA) packages on leadfree devices is a reliability concern when subjected to reliability stress test. With a polymer core in the solder ball ...

The interfacial reactions and joint reliabilities between Sn–9mass%Zn solder and an electroless nickel-immersion gold (ENIG) plated Cu substrate were investigated during reflow and isothermal aging at temperatures between 343 and 423K for aging times of up to 2400 h. After reflowing and aging, the intermetallic compound (IMC) formed at the interface was found to be AuZn3. No Ni-containing react...