نتایج جستجو برای: electronics packaging

تعداد نتایج: 105576  

2011
Cassie Gutierrez Rudy Salas Gustavo Hernandez Dan Muse Richard Olivas Eric MacDonald Michael D. Irwin Ryan Wicker W. M. Keck

Fabricating entire systems with both electrical and mechanical content through on-demand 3D printing is the future for high value manufacturing. In this new paradigm, conformal and complex shapes with a diversity of materials in spatial gradients can be built layer-by-layer using hybrid Additive Manufacturing (AM). A design can be conceived in Computer Aided Design (CAD) and printed on-demand. ...

Journal: :Advanced Materials 2021

Microbatteries The proliferation and performance of physically small electronics have been severely limited by the microbatteries that power them. In article number 2101760, John B. Cook, Paul V. Braun, James H. Pikul, co-workers report a new design paradigm for primary drastically improves energy density through use thick near-fully dense electrodeposited cathodes multifunctional current colle...

1990
M. BREIDENBACH T. DEAN M. J. FOX D. FREYTAG A. GIOUMOUSIS G. HALLER J. HOEFLICH D. HORELICK M. HUFFER H. KANG G. MAZAHERI D. J. NELSON J. J - - OLSEN G. OXOBY L. PAFFRATH J. J. RUSSELL S. SHAPIRO D. SHERDEN S. SMITH T. USHER G. BILEI M. CARPINELLI R. DELL ’ ORSO D. CAMPBELL A. GILLMAN D. A. PHILLIPS

The SLD detector consists of five major subsystems, each with associated front-end electronics and an integrated FASTBUS control and data acquisition system. This paper highlights the choices among electronic technologies that have been developed for the SLD detector electronics. The common control, calibration, and data acquisition architectures are described. The functions of selected SLD int...

Journal: :Results in physics 2022

Nano-copper sintering is one of new die-attachment and interconnection solutions to realize the wide bandgap semiconductor power electronics packaging with benefits on high temperature, low inductance, thermal resistance cost. Aiming assess high-temperature reliability sintered nano-copper interconnection, this study characterized mechanical properties particles using nanoindentation tests. The...

Journal: :Macromolecular Rapid Communications 2021

Frontispiece 2: In article number 2000657 by Ericka Ford and co-workers, novel cyclic-poly(phthalaldehyde) blended poly(ε-caprolactone) fibers are wet spun to exhibit fast transience of less than 50 s when exposed daylight the mechanical strength stretch ability an elastomer. The rate is further improved embedding gold nanoparticles in fibers. Daylight-triggered among flexible has potential use...

Journal: :مدیریت اطلاعات سلامت 0

introduction: with increasing production of health information, information technologies have been used for better management and usage of such data. this enormous increase in gathering and storing of information and widespread accessibility also concerns individuals regarding privacy and security of information. this research is concerned with this issue due to decisions on establishing indivi...

Qasim Murtaza Rajesh K. Singh Saurabh Agrawal

Electronics industry is one of the fastest growing industries in the world. In India also, there are high turnovers and growing demand of electronics product especially after post liberalization in early nineties. These products generate e-waste which has become big environmental issue. Industries can handle these e-waste and product returns efficiently by developing reverse logistics (RL) syst...

Journal: :Proceedings of the ... International Symposium on Microelectronics 2021

ABSTRACT A novel hydrogen activation technology based on activated or electron attachment (EA) has been developed for fluxless soldering at ambient pressure and normal temperature. The the potential to be used several applications in electronics packaging industry. Recent work from a joint effort between Air Products Sikama International alpha trials of production-scale furnace flux-free wafer ...

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