In this work, composite Ni–P-multiwalled carbon nanotube films were produced by electroless deposition. The main goal was to investigate the influence of multiwalled loading on local electrochemical behavior films, as probed scanning microscopy (SECM). coatings also characterized with respect their crystalline structure, surface, and cross-section morphologies. Adhesion strength examined scratc...

In this work the effects of various methods of agitation on the properties of electroless Ni-P-MoS2 composite coatings were investigated. Magnetic stirring as well as purging the solution with gas (Air, Oxygen, Nitrogen) were used. Plating rate, chemical composition, MoS2 distribution, and hardness of the deposit were measured. Topography of coating was studied with metallography and scanning e...

As the second part to a paper presented at the 2004 SMTA Pan Pacific Symposium, this paper further summarizes the results from technical qualification of the Ni/Pd/Au process. Whereas the previous paper examined the wire bonding capabilities of this surface finish, this second paper focuses specific attention to BGA applications. In these investigations, the solder joint integrity is measured u...

An attempt has been taken to improve the corrosion resistance of twinning-induced plasticity (TWIP) steels (Fe-25Mn and Fe-25Mn-3Al) by electroless Ni-P coating. Corrosion resistance in 3.5% NaCl and 0.1M H2SO4 solutions was characterized by the potentiodynamic polarization curves and Tafel method calculations. It was found that Ni-P coating improved the corrosion resistance by the factor of 4 ...

A wood-based composite was prepared via simple electroless Ni-Cu-P plating on birch veneer for EMI shielding. The effects of CuSO4·5H2O concentration on the metal deposition, elemental composition, phase structure, surface morphology, wettability, surface resistivity, and shielding effectiveness of coatings were investigated. The coatings were characterized using X-ray diffraction (XRD), X-ray ...

Electromigration of eutectic SnPb flip chip solder joints and their mean-time-to-failure ~MTTF! have been studied in the temperature range of 100 to 140 °C with current densities of 1.9 to 2.75 310 A/cm. In these joints, the under-bump-metallization ~UBM! on the chip side is a multilayer thin film of Al/Ni~V!/Cu, and the metallic bond-pad on the substrate side is a very thick, electroless Ni la...

A carbon-matrix nickel composite magnetoplasmonic film with a 3D sub-micron periodic triangular roof-type antireflection structure (SPTAS) was fabricated via a simple and promising method that combines chemosynthesis with biomimetic techniques. The Troides helena (Linnaeus) forewing (T_FW) was chosen as the biomimetic template. The carbon-matrix Ni wing fabricated via electroless Ni deposition ...

Abstract One of the largest problems with most current thermal power plants is cooling efficiency. This paper aims to massively reduce fuel consumption and heat wasted in hence CO 2 emissions by resolving fouling issues associated air-cooled condensers. In order dust deposition condensers, finned flat tubes were coated nickel−phosphorus nickel−phosphorus−polytetrafluoroethylene (Ni–P-PTFE) an e...

Electroless nickel is often plated on the surface of aluminum mirrors to improve the ability to polish the mirror surface. Electroless nickel plating can cause a bimetallic effect, creating distortion of a mirror surface if it is heated or cooled. Published data listing the thermal coefficient of expansion and Young’s modulus as a function of temperature for electroless nickel is not readily av...