نتایج جستجو برای: buried layer
تعداد نتایج: 292998 فیلتر نتایج به سال:
Introduction: Deciphering the cratering record on Mars has been challenging because it may reflect the changes in both the population of impactors and in the resurfacing processes on Mars. However, it is possible to determine the breadth of impactors captured in the cratering record. Extensive areas of resurfacing are of particular interest because they likely contain material from various ages...
X-ray photoelectron spectroscopy is used to probe the photoinduced shifts in the binding energies of Si2p, O1s, and C1s of the SiO2/Si interfaces of a number of samples having oxide and/or thin organic layers on top of p- and n-Si wafers. Whereas the photoinduced shifts, in each and every peak related, vary from 0.2 to 0.5 eV for the p-type samples, the corresponding shifts are substantially sm...
Ionic transport in metal/oxide heterostructures offers a highly effective means to tailor material properties via modification of the interfacial characteristics. However, direct observation of ionic motion under buried interfaces and demonstration of its correlation with physical properties has been challenging. Using the strong oxygen affinity of gadolinium, we design a model system of GdxFe1...
The Cu(In,Ga)(S,Se)(2)Mo interface in thin-film solar cells has been investigated by surface-sensitive photoelectron spectroscopy, bulk-sensitive x-ray emission spectroscopy, and atomic force microscopy. It is possible to access this deeply buried interface by using a suitable lift-off technique, which allows us to investigate the back side of the absorber layer as well as the front side of the...
By combining x-ray excited Auger electron diffraction experiments and multiple scattering calculations we reveal a layer-resolved shift for the Mg KL23L23 Auger transition in MgO ultrathin films (4-6 Å) on Ag(001). This resolution is exploited to demonstrate the possibility of controlling Mg atom incorporation at the MgO/Ag(001) interface by exposing the MgO films to a Mg flux. A substantial re...
A hybrid MCM-based 3-D integration technology for packaging intelligent power electronics modules has been developed. The bare power chips are buried in the ceramic frame with dispensed and screen printed dielectric encapsulates. This dielectric coating is designed to achieve planarization and open up the contacts of the power chips. A metallization layer, deposited and patterned on top of the ...
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