نتایج جستجو برای: glass bonding

تعداد نتایج: 114585  

Journal: :Physical review letters 2003
Randall W Hall Peter G Wolynes

A theory of the glass transition of network liquids is developed using self-consistent phonon and liquid state approaches. The dynamical transition and entropy crisis characteristic of random first-order transitions are mapped as a function of the degree of bonding and density. Using a scaling relation for a soft-core model to crudely translate the densities into temperatures, theory predicts t...

2017
Dongling Li Zhengguo Shang Zhiyu Wen

Au/Si eutectic bonding is considered to BE a promising technology for creating 3D structures and hermetic packaging in micro-electro-mechanical system (MEMS) devices. However, it suffers from the problems of a non-uniform bonding interface and complex processes for the interconnection of metal wires. This paper presents a novel Au/Si eutectic wafer bonding structure and an implementation method...

Journal: :Materials today communications 2021

Nanofibrous glass/ceramic rigid shapes with uncommon structures, consisting of electrospun vitreous silica nanofibers coated 5–30 nm thick Al2O3 or MgAl2O4 ceramic layers, were fabricated in this study. Ceramic nanolayers restricted the viscous flow and provided strong structural bonding during partial sintering at 1200 °C. The interface interactions between nanofiber core nanolayer defined res...

Journal: :Physical review. E, Statistical, nonlinear, and soft matter physics 2011
Masahiro Nakanishi Ryusuke Nozaki

A simplified model of a hydrogen-bonding network is proposed in order to clarify the microscopic structure of the cooperative rearranging region (CRR) in Adam-Gibbs theory [G. Adam and J. H. Gibbs, J. Chem. Phys. 43, 139 (1965)]. Our model can be solved analytically, and it successfully explains the reported systematic features of the glass transition of polyhydric alcohols. In this model, hydr...

Journal: :QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY 1998

Journal: :Journal of Inorganic and Organometallic Polymers and Materials 2023

Abstract Anodic bonding is a reliable packaging method for MEMS devices, and the surface properties of wafer directly affect efficiency. Therefore, treatment to be bonded necessary. Herein, effects three different cleaning processes (degreasing, piranha solution RCA solution) on were investigated by atomic force microscopy, scanning electron infrared spectroscopy, anodic experiments. The analys...

Journal: :IEEJ Transactions on Fundamentals and Materials 1995

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