Inequalities in thermomechanical properties of materials at interfaces of a modern package lead to a rise in periodic stresses during normal operation, making these sites crucial to the integrity of the entire product. Proper lifetime analysis for highly miniaturized interconnects is a real challenge. In addition, broad application of 100% quality standards in various industries has caused a ra...

We demonstrate multi-Gbps pulse signaling with inductively coupled interconnects across printed circuit boards and packaging interfaces. This has application in realizing sub-mm pitch Zero Insertion Force (ZIF) surface mount connectors and sockets. The signaling data rate achievable in our system is from 1Gbps to 8.5Gbps, which depends on the 3dB coupling frequency of the composite channel cons...

The performance features of MEMS transducers allow the development of a new class of small, low-power sensor microsystems which utilize a suite of sensors to support a wide range of applications. This paper presents a system-level framework for constructing such microsystems where system modularity for application adaptability is a primary design consideration. System architecture, communicatio...

The fastest growing package types in the electronics industry today are Bottom Termination Components (BTCs). While the advantages of BTCs are well documented, they pose significant reliability challenges to users. One of the most common drivers for reliability failures is the inappropriate adoption of new technologies. This is especially true for new component packaging like BTCs. Obtaining re...

As the electronics industry moves toward smaller form and fit factors, advanced packaging technologies are needed to achieve these challenging design requirements. Current design problems are not driven by circuit design capabilities but by an inability to reliably package these circuits within the space constraints. Innovative packaging techniques are required in order to meet the increasing s...

All-atom Molecular Dynamics simulations were used to study the coefficient of thermal expansion (CTE) in Cu/Zr amorphous alloys with various compositions. We explored possibility using these as bonding interface material between ceramics chips and copper leads power electronics microelectronic packaging applications an objective reducing CTE mismatch at interface. It was expected that appropria...

Product cost is a key driver in the consumer electronics market, which is characterized by low profit margins and the use of a variety of “big-D/small-A” mixed-signal system-on-chip (SoC) designs. Packaging cost has recently emerged as a major contributor to the product cost for such SoCs. Wafer-level testing can be used to screen defective dies, thereby reducing packaging cost. We propose a ne...

This paper demonstrates how the PIXAPP Photonics Packaging Pilot Line uses its extensive packaging capabilities across European partner network to design and assemble a highly integrated silicon photonic-based optical transceiver. The processes used are based on PIXAPP's open access rules or Assembly Design Kit (ADK). transceiver was designed have Tx Rx elements single photonic chip, tog...