Nanoimprint lithography (NIL) is a technology where fine structures on a mold (or template) are transferred onto a substrate coated with thermoplastic or with ultraviolet (UV) curing resins by making contact with the substrate while being heated or exposed to UV lights. Recently, NIL has been applied in semiconductor manufacturing to print fine features of circuits on LSI chips and memories at ...

Curing of the composite in a constant magnetic field low intensity (Н∼104 A/m) leads to anisotropic spatial distribution filler particles - carbonyl nickel powder. Thermal diffusivity with orthotropic structure was measured using "pulsed heat source" method. Increase thermal value found direction axis.

Based on the optimal proportion of resin and curing agent, an ultrahigh-temperature inorganic phosphate adhesive was prepared with aluminum dihydric phosphate, aluminium oxide ( α -Al₂O₃), etc. and cured at room temperature (RT). Then, nano-aluminum nitride (nano-AlN), nano-Cupric oxide (nano-CuO), and nano-titanium oxide (nano-TiO₂) were added into the adhesive. Differential scanning calorimet...

The demand for volume deployment of photonic components has increased, and with it the need to effectively manufacture in a reproducible and cost effective way. Therefore, it is important to keep the assembly process consistent and stable. A simple shear test setup was used in this study to determine the shear force that can be used as an instant indicator to the process stability of fiber arra...

UV cured epoxy systems represent complementary technology to the established heat cured epoxy systems for coating, adhesion and encapsulation of electronic devices. The UV cured epoxy systems offer significant benefits in terms of fast cure and thus very short production cycle time; low stress and better colour due to room temperature cure; process wise no mix ratio problem or anhydride handlin...

The effects of different bonding parameters, such as temperature, pressure, curing time, bonding temperature ramp and post-processing, on the electrical performance and the adhesive strengths of anisotropic conductive film (ACF) interconnection are investigated. The test results show that the contact resistances change slightly, but the adhesive strengths increase with the bonding temperature i...

Underfill encapsulant is critical to the reliability of the flip-chip solder joint interconnects. Novel no-flow underfill encapsulant is an attractive flip-chip encapsulant due to the simplification of the no-flow underfilling process. To develop the no-flow underfill material suitable for the no-flow underfilling process of flip-chip solder joint interconnects, we have studied and developed a ...