The objective of the work reported is to study the effect of wavelength and the material removal mechanisms of a laser process for removing copper oxide from copper. The removal of copper oxide is necessary in electronics device fabrication in order to improve the surface wetability and so achieve a good quality solder joint. Such a laser cleaning process could be incorporated into an existing ...

Welding of metals and alloys is important to Dentistry for fabrication of dental prostheses. Several methods of soldering metals and alloys are currently used. The purpose of this study was to assess, using the flexural strength testing, the efficacy of two processes Nd:YAG laser and TIG (tungsten inert gas) for welding of pure Ti, Co-Cr and Ni-Cr alloys. Sixty cylindrical specimens were prepar...

In this study, interfacial reactions of electrolytic Ni and electroless Ni(P) metallization of the ball-grid-array (BGA) substrate with the molten n–9Zn (wt.%) eutectic solder alloy were investigated, focusing on the shear strengths and the identification of the intermetallic compound IMC) phases at various reflow periods. Zn-containing Pb-free solder alloys were kept in molten condition (240 ◦...

The integration and miniaturization trend of the electronic packaging leads to much finer pitch of the device and package lead terminations. Several reliability concerns and issues that were previously not encountered are now surfacing. The objective of this thesis work is to investigate the reliability of the package-to-board interconnection from the perspective of solder joint metallurgy. It ...

An experiment on the early stages of intermetallic compound layer growth during soldering and its theoretical analysis were conducted with the intent to study the controlling factors of the process. An experimental technique based on fast dipping and pulling of a copper coupon in liquid solder followed by optical microscopy allowed the authors to study the temporal behavior of the sample on a s...