نتایج جستجو برای: intermetallic compound layer
تعداد نتایج: 408179 فیلتر نتایج به سال:
Electromigration is one of the most important research issues affecting reliability solder joints. Current-induced Joule heating affects electromigration behavior Solder joints with different cross-sectional areas were designed to obtain properties. The effects interfacial intermetallic compound (IMC) and mechanical properties Sn58Bi/Cu studied for results showed that as area increased, joint i...
Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. So far, many papers have reported effects of cooling speed, type of solder pastes and solder fluxes o...
Department of Physics and Astronomy, Rice University, Houston, TX 77005, USA. Na tional High Magnetic Field Laboratory, Florida State University, Tallahassee, FL 32310 USA. Department of Mechanical Engineering, Texas A&M University, College Station TX 77843, USA. Materials Science and NanoEngineering, Rice University, Houston, TX 77005, USA. Department of Translational Molecular Pathology, Univ...
A complete determination of the crystal structure of the binary intermetallic compound most rich in zinc, the t-phase, in the zirconium-zinc system has been carried out with use of all intensity data obtainable from single crystal Weissenberg photographs taken with Cu Ka radiation. The composition of the completely ordered phase is ZrZn22. The refinement of the structure was carried out by appl...
A comprehensive kinetic analysis was established to investigate the electromigration (EM) enhanced intermetallic compound (IMC) growth and void formation for Sn-based Pb-free solder joints with Cu under bump metallization (UBM). The kinetic model takes into account Cu–Sn interdiffusion and current stressing. Derivation of the diffusion coefficients and the effective charge numbers for the inter...
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