نتایج جستجو برای: glass bonding

تعداد نتایج: 114585  

Journal: :The Journal of chemical physics 2015
Kai Zhang Yanhui Liu Jan Schroers Mark D Shattuck Corey S O'Hern

Bulk metallic glasses (BMGs) are amorphous alloys with desirable mechanical properties and processing capabilities. To date, the design of new BMGs has largely employed empirical rules and trial-and-error experimental approaches. Ab initio computational methods are currently prohibitively slow to be practically used in searching the vast space of possible atomic combinations for bulk glass form...

2011
Steven J. Lindauer Mina Abdolahi Steven Lindauer Bhavna Shroff

A Novel Bioactive Glass-Enhanced Orthodontic Bonding Resin: A shear bond strength study By Cole R. Johnson, D.D.S. A thesis submitted in partial fulfillment of the requirements for the degree of Master of Science in Dentistry at Virginia Commonwealth University. Virginia Commonwealth University, 2011 Thesis Director: Eser Tüfekçi, D.D.S, M.S., Ph.D Associate Professor, Department of Orthodontic...

2000
A. Berthold P. M. Sarro M. J. Vellekoop

In this paper a two-step glass wet-etching process is presented. This process allows the fabrication of well-defined shallow recesses (typically 1-40μm) together with deep trenches or waferthrough holes (100-500μm) in the same glass wafer. The etching solutions and the masking materials used are described for the three glass types frequently used in sensor fabrication. This process is developed...

2011
M. A. Uddin H. P. Chan

In a flip-chip-on-glass (FCOG) assembly, anisotropic conductive film (ACF) is used as the adhesive to bind the desired interconnection between the flip chip and glass substrate. However, it remains a challenge to develop the ACF bonded flip chip packages with low contact resistance. Considerable research has been conducted recently to investigate the effect of different parameters on the contac...

Journal: :The journal of contemporary dental practice 2012
Hashim Ali Sasi Maroli

AIM To find an alternative to popular orthodontic bonding agent composite resin and elimination of acid etching. To assess GC Fuji Ortho as an orthodontic bonding agent under different enamel conditions and evaluate the shear bond strength. Enamel surfaces intentionally contaminated with saliva, conditioned enamel using Fuji dentin conditioner and conventional 37% phosphoric acid/60 seconds. To...

Journal: :European journal of orthodontics 2010
Asli Baysal Tancan Uysal

The aims of this study were to evaluate the shear bond strength (SBS), fracture mode, and wire pull out (WPO) resistance between resin-modified glass ionomer cement (RMGIC) and conventional orthodontic composite used as a lingual retainer adhesive. Forty lower human incisors were randomly divided into two equal groups. To determine the SBS, either Transbond-LR or Fuji Ortho-LC was applied to th...

Journal: :Brazilian oral research 2013
Ana Paula Rodrigues Gonçalves Aline de Oliveira Ogliari Patrícia dos Santos Jardim Rafael Ratto de Moraes

The influence of chemical cleaning agents on the bond strength between resin cement and glass-fiber posts was investigated. The treatments included 10% hydrofluoric acid, 35% phosphoric acid, 50% hydrogen peroxide, acetone, dichloromethane, ethanol, isopropanol, and tetrahydrofuran. Flat glass-fiber epoxy substrates were exposed to the cleaners for 60 s. Resin cement cylinders were formed on th...

Journal: :Physical review letters 2005
P Gangopadhyay R Kesavamoorthy Santanu Bera P Magudapathy K G M Nair B K Panigrahi S V Narasimhan

Results obtained from the optical absorption and photoluminescence (PL) spectroscopy experiments have shown the formation of excitons in the silver-exchanged glass samples. These findings are reported here for the first time. Further, we investigate the dramatic changes in the photoemission properties of the silver-exchanged glass samples as a function of postannealing temperature. Observed cha...

Journal: :The Review of scientific instruments 2010
S Dimov R G Bennett A Córcoles L V Levitin B Ilic S S Verbridge J Saunders A Casey J M Parpia

We demonstrate the use of anodic bonding to fabricate cells with characteristic size as large as 7 x 10 mm(2), with height of approximately 640 nm, and without any internal support structure. The cells were fabricated from Hoya SD-2 glass and silicon wafers, each with 3 mm thickness to maintain dimensional stability under internal pressure. Bonding was carried out at 350 degrees C and 450 V wit...

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