Abstract A more circular economy aims to reduce global material consumption, make the most out of our resources, and create a sustainable economic system. In this paper, we analyze how different actions in Norway affect indicators three pillars development: prosperity (measured by value added), social equity employment opportunities), environmental protection greenhouse gas emissions). Based on...

This paper reviews the application and operation of integrated sensors and actuators in biological and physiological environments. Integrated transducers are widely employed for invasive and non-invasive patient monitoring, for recording and understanding biological events and systems, for delivery of chemicals and electrical stimuli into the body, and as a means for eventual realization of clo...

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INTRODUCTION Pursuing a strategy of power density leadership, Fairchild Semiconductor has released a new power specific packaging technology, Dual Cool TM , to meet the rigors of escalating demand for more improved thermal management in electronics designs. This technology creates a direct heat path from both the drain and source sides of the vertical MOSFET die structure through the addition o...

Charlie V. Lam Boston Micromachines Corporation 30 Spinelli Place Cambridge, Massachusetts 02138 Abstract. We present the progress in the development of a 4096element microelectromechanical systems !MEMS" deformable mirror, fabricated using polysilicon surface micromachining manufacturing processes, with 4 !m of stroke, a surface finish of "10 nm rms, a fill factor of 99.5%, and a bandwidth of ...

Availability modeling of the proposed International Linear Collider (ILC) predicts unacceptably low uptime with current electronics systems designs. High Availability (HA) analysis is being used as a guideline for all major machine systems including sources, utilities, cryogenics, magnets, power supplies, instrumentation and controls. R&D teams are seeking to achieve total machine high availabi...

For the high-power modules packaging, Cu clip bonding has gained growing interest to replace multiple wire-bonding for benefits of lower resistance and improved thermal performance, which is especially beneficial higher reliability. However, current interconnection materials processes cannot fully meet reliability requirements emerging integrated structure. Brazing alloys can serve in high-temp...

Grinding wafers is a well established process for thinning wafers down to 100 μm for use in smart cards and stacking chips. As a result of the mechanical process, the wafer backside is compressively stressed. In this paper, authors investigate the influence of the backside induced stress in Si wafers thinned down to ~20μm by means of an IR time-of-flight like technique. Such aggressive thinning...

Surface micromachining has become an established technology for inertial sensing. Compatibility with standard IC fabrication processes enables monolithic integration of the sensing element and interface electronics for reduced size and power dissipation, simplified packaging, and increased functionality. The need to resolve sub-Angstrom displacements poses a challenge on the interface. Capaciti...

Inequalities in thermomechanical properties of materials at interfaces of a modern package lead to a rise in periodic stresses during normal operation, making these sites crucial to the integrity of the entire product. Proper lifetime analysis for highly miniaturized interconnects is a real challenge. In addition, broad application of 100% quality standards in various industries has caused a ra...