In this paper a virtual mutual inductance approach is used to analyse the performance of transverse flux machines (TFMs). The virtual mutual inductance between the stator windings and the magnets’ equivalent currents is obtained by integrating the flux produced by the stator windings over the surface of the magnets. Key design parameters such as back EMF, torque, phase inductance and power fact...

A 1.2-V fully integrated 0.35m inductively degenerated common source CMOS low-noise amplifier has been demonstrated at 2.4 GHz in this paper. A simple common source configuration can be operated at lower voltage and has lower output impedance when compared with a conventional high output impedance cascode LNA circuit topology. The input matching inductance, output matching inductance, and sourc...

The importance of on-chip power-rail inductance in generating delta-I power-supply noise is examined in this paper using systematic circuit simulation of the complete integratedcircuit power net. This source of noise is compared to the resistive IR drop in the net, and to the delta-I noise due to both high-inductanceand low-inductance-bonding packages. Results are presented for a typical on-chi...

We calculate the factor by which thermal phase fluctuations, as distinct from phase-slip fluctuations, increase the inductance LJ of a resistively shunted Josephson junction ~JJ! above its mean-field value L0 . We find that quantum mechanics suppresses fluctuations when T drops below a temperature, TQ5\/kBGL0 , where G is the shunt conductance. Examination of the calculated sheet inductance LA(...

A lumped parameter model for tokamak plasma current and inductance time evolution as a function of plasma resistance, non-inductive current drive sources and boundary voltage or poloidal field coil current drive is presented. The model includes a novel formulation leading to exact equations for internal inductance and plasma current dynamics. Having in mind its application in a tokamak inductiv...

Backside via self-inductance is a critical electrical quantity needed for the design of Monolithic Millimeter-wave Integrated Circuits (MMIC). We have investigated a simple, analytical method for accurately calculating via inductance based upon physical geometry. The analytical method enables backside via process development to be tailored to meet design goals. Conversely, the sensitivity of RF...

Abstract Accurate integrity assessment of on-chip clock lines is difficult without any a priori knowledge about their inductance at an early stage in the clock design process. This paper introduces an efficient approach to estimate the bounds of on-chip clock wire inductance at the very beginning of the design stages. With this information, more accurate waveforms along the clock distribution n...

In this paper, we propose a new exact closed form mutual inductance equation for on-chip interconnects. We express the mutual inductance between two parallel rectangular conductors as a weighted sum of self-inductances. We do not place any restrictions on the alignment of the two parallel rectangular conductors. Moreover, they could be co-planar or reside on different layers. Most important, ex...