Solder paste is a homogeneous, stable suspension of solder powder particles suspended in a flux binder, and is one of the most important process materials today in surface mount technology (SMT). By varying the solder particle size, distribution and shape, as well as the other constituent materials, the rheology and printing performance of solder pastes can be controlled. Paste flow behavior is...

Thixotropy is one of the oldest documented rheological phenomenon in colloid science and may be defined as an increase of viscosity in a state of rest and a decrease of viscosity when submitted to a constant shearing stress. This behavior has been exploited in recent years to prepare injectable hydrogels for application in drug delivery systems. Thixotropic hydrogels may be profitably used in t...

Proposed special requirements exist for the rheological properties and time varying characteristics of 3D printing cementitious materials (3DPC). In this study, high dispersion polycarboxylate superplasticizer (HD PC) fluidity retaining (FR were used to control behaviors 3DPC. The correlation interval, interlayer bonding strength investigated. results indicated that FR PC improved retention abi...