This paper addresses the differences in thermal characterization and modeling for a multi-chip package with respect to a single-chip package. Since no thermal measurement system is commercially available to power more than one device during the test, the thermal model can be validated only with a single-heat source. Wires, which are used to connect the package under the test to the measurement ...

We consider the heat equation with spatially variable thermal conductivity and homogeneous Dirichlet boundary conditions. Using Method of Fokas or Unified Transform Method, we derive solution representations as limit solutions constant-coefficient interface problems where number subdomains interfaces becomes unbounded. This produces an explicit representation solution, from which can compute de...