In the search for applications alloys developed under philosophy of High Entropy Alloy (HEA)-type materials, focus may be placed on where current also use multiple components, albeit at lower levels than those found in HEAs. One such area, with complex compositions are already found, is filler metals used joining. soldering (<450 °C) and brazing (>450 °C), metal taken above their liquidus...

Sn–Bi alloys are desirable candidates for soldering components on printed circuit boards (PCBs) because of their low melting point and reduced cost. While certain tin–bismuth solders well characterized many new in this family have been developed which need proper characterization. The following study looks at the behavior four different alloys—traditional 42Sn58Bi 42Sn57Bi1Ag two alloys—in sold...

The structural and conducting properties of single-wall carbon nanotubes SWCNs in soldered configuration is obtained using efficient formalisms based on spin-polarized tight-binding formulation incorporating full consideration of s, p, and d basis sets for carbon and metal atoms. The full structural relaxation of the combined SWCN and metal system is found to be essential for realistic characte...

In this study, Ni-Cu/SAC composite solders with different Cu contents were used as an interlayer to solder Al alloy joints at 250 ℃ for time. The results showed that the formation and evolution of microstructure affected by contents. Ni18Cu/SAC joint, Sn was completely consumed form a solid-phase joint in 5 min. And (Cu,Ni)6Sn5 initial phase formed from reaction between Ni18Cu skeleton. Due hig...

Abstract The goal of this research is to study the applicability diffusion boriding process as a high-temperature thermochemical heat treatment enhance lifetime steel selective soldering tools. main purpose work discuss behavior double-phase (FeB/Fe 2 B) iron-boride coating on surface different steels (DC04, C45, CK60, and C105U) against stationary SAC309 lead-free solder liquid alloy. boride w...

Although lead-free soldering has been main stream in the industry since 2006 with the replacement of the eutectic SnPb system by the SnAgCu system, the development of drop-in lead-free alternatives for high melting high lead solder alloys is still far from mature. The BiAg alloy exhibits acceptable bulk strength, but very poor ductility and wetting. Therefore, it is not acceptable as an option....

early 40 years of experience with wave soldering N have resulted in processes that routinely produce several thousand, defect-free solder joints per minute. However, the climate of electronics manufacturing has changed significantly over the past 10 to 15 years. Environmental restrictions as well as the high quality of products made offshore has placed new demands and challenges on the electron...

In this study, we have investigated the effect of thermal aging on impact strength of Sn-Ag-Cu solder bumps in fluxless soldering process using formic acid atmosphere. We conducted impact tests on as-reflowed and thermally-aged solder bumps, which were fabricated on either formic acid atmosphere or a liquid flux. The results indicated that the morphology of the intermetallic compound layers in ...

“Sagging” of the palatal cusp upper second molars is a common finding observed during orthodontic treatment which may develop heavy balancing side contacts, have been found to be detrimental harmonious function masticatory system. Various modifications transpalatal arch (TPA) are advocated correct crossbite, but most them will utilize an additional step soldering wire attachment TPA. In this cl...

Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG) is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which w...