نتایج جستجو برای: electronics packaging

تعداد نتایج: 105576  

2013
Shinichi Ogawa Muhannad Bakir Fei Liu Benjamin Fletcher Eric Joseph Yu Zhu Jemima Gonsalves William Price Gregory Fritz Sebastian Engelmann Adam Pyzyna Zhen Zhang Cyril Cabral Michael Guillorn

In semiconductor world, there is a new paradigm shift from chip-scaling to system-scaling to meet the ever-increasing electronic system demands in power saving, performance, and functionality (including memory bandwidth) increase, form factor improvement and cost reduction. This shift is also triggered by the growing concerns for industry to sustain Moore's Law. Innovations on wafer-...

2006
Renee Wever Casper Boks Ab Stevels

Two major changes are currently taking place in the world of Consumer Electronics. They are, first, the relocation of production to low-wage countries, in particularly China. This results in longer distribution distances, which lead to a higher relative importance of this phase in the entire life cycle. To make this phase as efficient as possible, products should be packed as volume efficient a...

2010
Nien-Hua Chao

Potted electronics are becoming quite common in precision artillery applications due to demands for increased structural-robustness of these miniaturized smart-munitions. In field artillery applications, the potted electronics are inactive for most of their lifetime where they may have been stored in a bunker without environmental (temperature and humidity) controls for up to 20 years. In contr...

Journal: :ACS nano 2015
Junwen Zhong Hongli Zhu Qize Zhong Jiaqi Dai Wenbo Li Soo-Hwan Jang Yonggang Yao Doug Henderson Qiyi Hu Liangbing Hu Jun Zhou

Self-powered human-interactive but invisible electronics have many applications in anti-theft and anti-fake systems for human society. In this work, for the first time, we demonstrate a transparent paper-based, self-powered, and human-interactive flexible system. The system is based on an electrostatic induction mechanism with no extra power system appended. The self-powered, transparent paper ...

2001
Zhenxian Liang Fred C. Lee

A hybrid MCM-based 3-D integration technology for packaging intelligent power electronics modules has been developed. The bare power chips are buried in the ceramic frame with dispensed and screen printed dielectric encapsulates. This dielectric coating is designed to achieve planarization and open up the contacts of the power chips. A metallization layer, deposited and patterned on top of the ...

2015
Brian D. Iverson Suresh Garimella Suresh V. Garimella

Micropumping has emerged as a critical research area for many electronics and biological applications. A significant driving force underlying this research has been the integration of pumping mechanisms in micro total analysis systems and other multi-functional analysis techniques. Uses in electronics packaging and micromixing and microdosing systems have also capitalized on novel pumping conce...

2012
Laura Frisk

The trends in the electronics industry have for several decades been for smaller size combined with greater functionality. One enabler for this trend has been development of new packaging solutions which has required the development of new materials and also new interconnections technologies. In the development of these technologies it has been essential to have effective tools to study the str...

2003
David J. Anderson

A successful implant used for FES and sensor systems that support FES depends on the confluence of device fabrication technology, biomaterials electronics packaging and signal conditioning and processing. Over many years, we have been building a technology that embodies as much of this function into a system that is batch processed using silicon technology in much the same way a computer or com...

2007
Bruce W. Ohme Michael T. Johnson James C. Hansen

Electronics are used in modern oil and gas exploration to collect, log, and/or process data such as heading and inclination, weight on the bit, vibration, seismic/acoustic response, temperature, pressure, radiation, and resistivity of the strata. High-temperature electronics are needed that can reliably operate in deep-well conditions (up to 250°C). The U.S. Department of Energy Deep Trek progr...

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