In a ring laser gyroscope, due to the rotation and the Sagnac effect, a phase difference between the two counter-propagating beams is generated. In this device, the higher phase difference between these two beams causes the better the interference pattern detection, and thus the sensitivity is increased. In this paper, the effect of inserting a dielectric-graphene photonic crystal inside a ring...

Correct selection of manufacturing condition is one of the most important aspects which should be considered in the majority of manufacturing processes,  particularly in the process related to advanced machining process like electrical discharge machining. In electrical discharge machining (EDM), dielectric fluid plays an important role since machining characteristics are greatly influenced by ...

Barium substituted nanocrystalline ferrites with chemical composition BaxCa1-xFe2O4 (x =0.0 to 0.25) BCAF were prepared by solution combustion method. The phase formation of mixed spinal structured ferrites was confirmed by PXRD analysis. The average crystallite size was calculated using Debye-Scherrer formula and it was found to be in the range of 27-44 nm. Surface morphology was analyzed by S...

correct selection of manufacturing condition is one of the most important aspects which should be considered in the majority of manufacturing processes,  particularly in the process related to advanced machining process like electrical discharge machining. in electrical discharge machining (edm), dielectric fluid plays an important role since machining characteristics are greatly influenced by ...

dielectric properties of agricultural products is one of the most important physical properties of agricultural and food products and these properties are used heavily in developing as new technology for use in agriculture and related industries. therefore, in this study investigated the changes in the dielectric properties of pazhohesh and ghaem varieties of paddy as a dielectric material four...

The effect of electron beam (e-beam) curing on an ultra low dielectric constant material, porous organosilicate glass (OSG) is investigated. In conventional IC integration processes, photoresist (P. R.) stripping with O2 plasma and wet chemical stripper is an inevitable step. However, dielectric degradation often occurs when low-k dielectrics undergo the PR stripping processing. This limits the...