c-Chart was frequently used to monitor wafer defects during IC manufacturing. The clustering degree of defect on a wafer will increase along with the area of wafer gradually enlarging. The defect clustering causes the Poisson-based c-chart to exhibit many false alarms. Although several revised control charts have been developed to reduce the number of false alarms, those control charts still ha...

Silicon wafer thickness reduction without increasing the wafer strength leads to a high fracture rate during subsequent handling and processing steps. Cracking of solar cells has become one of the major sources of solar module failure and rejection. Hence, it is important to evaluate the mechanical strength of solar cells and factors influencing this. The purpose of this work is to understand t...

In RF-MEMS packaging, next to the protection of movable structures, optimization of package electrical performance plays a very important role. In this work, a wafer-level packaging process has been investigated and optimized in order to minimize electrical parasitic effects. The package concept used is based on a wafer-level bonding of a capping silicon substrate with throughsubstrate intercon...

The importance of semiconductor wafer fabrication has been increasing steadily over the past decade. Wafer fabrication is the most technologically complex and capital intensive phase in semiconductor manufacturing. It involves the processing of wafers of silicon in order to build up layers and patterns of metal and wafer material. Many operations have to be performed in a clean room environment...

Lot output time prediction is a critical task to a wafer fab (fabrication plant). Traditional studies are focused on prediction accuracy and efficiency. Another performance measure that is as important but has been ignored is the achievability of an output time forecast, which is defined as the possibility that the fabrication on the wafer lot can be finished in time before the output time fore...

Title of Dissertation: MODELING AND SIMULATION OF A TUNGSTEN CHEMICAL VAPOR DEPOSITION REACTOR Hsiao-Yung Chang, Doctor of Philosophy, 2000 Dissertation directed by: Assistant Professor Raymond A. Adomaitis Department of Chemical Engineering Chemical vapor deposition (CVD) processes are widely used in semiconductor device fabrication to deposit thin lms of electronic materials. Physically based...

This paper explores the feasibility of constructing an autonomous sensor array on a standard silicon wafer. Such a sensor-wafer would include integrated electronics, power, and communications, and would be capable of being placed into a standard production process step, or short sequence of steps. During the processing of the sensor-wafer, various process parameters would be measured and record...

Semiconductor industry has tremendous development in recent decades. According to Moore’s Law [1], semiconductor wafer manufacturers have to search improvement opportunities constantly in order to be competitive. International technology roadmap for semiconductor [2] has indicated the possible scenarios for 450 mm wafer fabs, and the conveyor will be a potential solution to realize transportati...