An application software package implementation is a complex endeavour, and as such it requires the proper understanding, evaluation and redefining of the current business processes of an organisation to ensure that the implementation delivers on the objectives set at the start of the project. Numerous factors exist that may contribute to the unsuccessful implementation of application software p...

Batch mode micro-electro-discharge machining ( EDM) is a lithography-compatible microfabrication method suitable for making devices from bulk metals, including stainless steel. In high-density patterns, spurious discharges through debris can cause workpiece edge rounding, fast tool wear, and mushroom-shaped metal recasting of the tool. This paper reports a Si coating technique that acts as a di...

WoredaNet is a Wide Area Network intended to link all woreda 1 administrative units in Ethiopia. The technology presents unique opportunities to facilitate the application of e-Government packages in the country. This study is a work in progress that utilizes the Unified Theory of Acceptance and Use of Technology (UTAUT) for the understanding of acceptance and adoption of Information Technology...

By using classified agricultural software products registered during last 15 years from 1994 to 2009, the author analyzed data and statistics in order to look at growth in number of the agro-software packages, their application areas, and research and development organizations, as well as their contribution to the agricultural IT industry in China. Based on the analysis, the article also assess...

B. Gajdzik, The Silesian University of Technology, Faculty of Materials Science and Metallurgy, Katowice, Poland K. Grzybowska, Poznan University of Technology, Faculty of Engineering Management, Poznan, Poland The article presents notions connected with resource structure of useful knowledge packages in metallurgical enterprise. Dependence between building competence of employees and using kno...

This contribution presents the results of the “Speech technology integrated learning modules for Intercultural Dialogue” project. The project objective was to increase the availability and quality of e-learning opportunities for less widely-used and less taught European languages using a user-friendly and highly accessible learning environment. The integration of new Text-to-Speech developments...

Copper wire bonding of microelectronic parts has developed as a means to cut the costs of using the more mature technology of gold wire bonding. However, with this new technology, changes in the bonding processes as well as bonding metallurgy can affect product reliability. This paper discusses the challenges associated with copper wire bonding and the solutions that the industry has been imple...

Trace gas analysis by near-infrared Tunable Diode Laser Absorption Spectroscopy (TDLAS) has evolved over the past decade from a laboratory specialty to an accepted, robust, and reliable industrial process monitoring and control technology. Early industrial-quality TDLAS analyzers occupied full instrumentation racks and frequently cost several hundred thousands of dollars to purchase and install...

A new microelectronics packaging technique, called Solid logic Technology (SLT), utilizes silicon planar glass-encapsulated transistors and diodes, and graphic arts techniques for producing high-quality, passive components having tight tolerances. The result is a process permitting the low-cost realization of a variety of versatile, high-performance circuit modules. The salient features of SLT ...