نتایج جستجو برای: soldering alloy
تعداد نتایج: 54605 فیلتر نتایج به سال:
Abstract At present, Sn-3.0Ag-0.5Cu (SAC305) solder is one of the commonly used lead-free solders, and copper-clad laminate PCB substrate. SAC copper substrate mainly generate two intermetallic compounds (IMCs) Cu6Sn5 Cu3Sn during soldering process. Based on first principles, this paper analyzes formation difficulty kinds IMCs generated in soldering, failure mechanism Sn/IMC IMC/Cu interfaces. ...
The influence of Cu and Ni additions on the morphology of the intermetallic compounds (IMC) formed at the interface of the liquid Sn-Cu solder and the Cu substrate has been studied. At low Cu concentrations only a thin IMC layer is formed which remains almost unchanged in time and the substrate is dissolving quickly. Ni additions significantly accelerate the growth kinetics of the IMC layer, pr...
Background and Aims: Soldering is one of the most common activities in metal industries. Lead is used in soldering process and has considerable toxic effects. The aim of this study, therefore, was biological and environmental monitoring and investigating the effects of exposure to lead in soldering unit workers at an automobile industry. Methods: In order to evaluate biological and enviro...
Introduction: Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nanoshells, a new class of nanoparticles consisting of a dielectric cor...
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