In a power module the parasitic inductance limits dynamic high-frequency performance, and area of cooling surfaces capability. This article presents new 3-D electronic design methodology based on concept mutual cancellation multisided heat transfer. New prismatic packaging concepts are proposed for wide band gap devices, where devices can be mounted at acute angles to adjacent interconnects or ...

As sensing and electronic technology has improved, the use of bio-logging tags for the study of marine mammals has steadily grown. These tags require the electronics to be packaged in a housing that protects it from the environment, maintains proper configuration of the sensors, and provides a means of attachment to the animal. The packaging must provide this functionality in a hydrodynamic for...

Nanocomposites made up of polymer matrices and carbon nanotubes are a class of advanced materials with great application potential in electronics packaging. Nanocomposites with carbon nanotubes as fillers have been designed with the aim of exploiting the high thermal, electrical and mechanical properties characteristic of carbon nanotubes. Heat dissipation in electronic devices requires interfa...

INTRODUCTION Wafer Level Packages have emerged as the fastest growing semiconductor packaging technology. Rather than a single solution, wafer level packaging technologies are a set of different solutions including flip-chip wafer bumping, electroplated gold, solder bumps and recent copper pillar technologies. These chips can be

This paper presents a review of silicon micromachined accelerometers and gyroscopes. Following a brief introduction to their operating principles and specifications, various device structures, fabrication technologies, device designs, packaging, and interface electronics issues, along with the present status in the commercialization of micromachined inertial sensors, are discussed. Inertial sen...