Nickel-Phosphorus (Ni-P) composite coatings were prepared on a poplar veneer surface via a simple electroless nickel (Ni) approach. The substrate deformation, flatness, crystalline structure, and wear resistance of the NiP composite coatings were investigated. The deformation degree of the substrate decreased as the number of deposition steps was increased. The flatness and wear resistance of t...

Three-dimesional hierarchical electrodes exhibiting multi-dimensional geometries provide exceptional advantages for advanced energy storage performance. In this work, we report the fabrication and characterization of biotemplated hierarchical-Ni/NiO electrodes enabled by thermal oxidation of electroless Ni-coated Tobacco mosaic viruses (TMVs) self-assembled on Au-coated Si micropillar arrays. U...

Electroless deposition or chemical coating is a well-established industrial technique that gaining popularity. The purpose of the current investigation was to determine how long heat treatment process had on mechanical and corrosion performances Ni-P low-carbon steel. performed steel using salt bath. coated samples were treated at 400°C under atmospheric condition muffle furnace. offers greater...

High energetic aluminum nanoparticles are mainly used as additive in solid rocket propellants. However, fabrication of these aluminized energetic materials is associated with decreasing the burning rate of propellants due to problems such as oxidation and agglomeration of nanoparticles. In this study, to improve combustion performance of aluminum nanoparticles, coating by metallic Ni shell...

Cu-filled TSV (through silicon via) is important technology for 3-D LSIs in order to obtain higher packing density, faster signal transmission, and lower power consumption. Diameter of TSV is expected to be smaller than 2 μm, and its aspect ratio to be larger than 10 in near future [1]. For realizing a high aspect ratio Cu-filled TSV, it is essentially important to form the barrier and seed lay...

As a surface finish, electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention for both packaging/IC-substrate and PWB applications. With a lower gold thickness compared to conventional electroless nickel / immersion gold (ENIG) the ENEPIG finish offers the potential for higher reliability, better performance and reduced cost.[1,2] This paper shows th...

Protective coatings can prolong the lifespan of engineering components. Electroless Ni-P coating is a very hard with high corrosion resistance, but low toughness. The addition NiTi nanoparticles into has shown potential to increase toughness electroless and could expand its usability as protective for more applications. However, study tribological behaviour wear mechanisms Ni-P-NiTi composite b...