Printed Electronics (PE) involves additive deposition of functional materials on a substrate via printing processes to realize electronic circuits, interconnects, electrical components or devices. This methodology is opposite the conventional microelectronics industry which based subtractive manufacturing techniques (e.g. etching). Some advantages PE over electronics are low prototyping costs, ...

Microfluidic devices have applications in chemical analysis, biomedical devices and ink-jets. An integrated microfluidic system incorporates electrical signals on-chip. Such electro-microfluidic devices require fluidic and electrical connection to larger packages. Therefore electrical and fluidic packaging of electro-microfluidic devices is key to the development of integrated microfluidic syst...

High-performance giant magnetoresistive (GMR) sensorics are realized, which are printed at predefined locations on flexible circuitry. Remarkably, the printed magnetosensors remain fully operational over the complete consumer temperature range and reveal a giant magnetoresistance up to 37% and a sensitivity of 0.93 T(-1) at 130 mT. With these specifications, printed magnetoelectronics can be co...

Silicon integration has delivered tremendous cost, space and power savings across a wide variety of consumer electronics products, enabling handset designers to meet strong demand for more highly integrated wireless semiconductor solutions capable of providing new voice, data and multimedia capabilities without increasing the size, cost or power requirements of next-generation mobile handsets. ...

This report describes a system of electronics to be used with a proportional wire chamber hodoscope. The system, which uses CAMAC packaging and data handling philosophy, consists of octo (8 channel) wire signal amplifiers, octo 4-bit per wire latch modules, gate fanout modules, crate controllers, and two types of data processor-interface units to the SDS 9300 computer. System operation is expla...

Processes based on organic or metal-oxide semiconductors and able to manufacture electronics at near-toambient temperature are ideally suited for applications that require mechanical flexibility and ultra-low-cost. Examples include bendable displays, large-area sensor surfaces for manmachine interfaces, and smart sensors embedded in food packaging. The paper discusses key circuit blocks manufac...