Monitoring wet and dry process using precipitation changes

A nonparametric wet/dry spell model for resampling daily precipitation

A nonparametric wet/dry spell model is developed for resampling daily precipitation at a site. The model considers alternating sequences of wet and dry days in a given season of the year. All marginal, joint, and conditional probability densities of interest (e.g., dry spell length, wet spell length, precipitation amount, and wet spell length given prior to dry spell length) are estimated nonpa...

Wet and Dry Etching Theory

Are Dry Mergers Dry, Moist, or Wet?

We present a spectral analysis of a sample of red-sequence galaxies identified by van Dokkum (2005) as dry merger remnants and ongoing dry mergers. Kinematics, stellar population absorption features, and ionisation from emission lines, are derived. We find that approximately half of the sample showing strong tidal features have younger stellar populations than a control sample at a given veloci...

Characterizing differences in precipitation regimes of extreme wet and dry years: implications for climate change experiments.

Climate change is intensifying the hydrologic cycle and is expected to increase the frequency of extreme wet and dry years. Beyond precipitation amount, extreme wet and dry years may differ in other ways, such as the number of precipitation events, event size, and the time between events. We assessed 1614 long-term (100 year) precipitation records from around the world to identify key attribute...

Pushing precipitation to the extremes in distributed experiments: recommendations for simulating wet and dry years.

Intensification of the global hydrological cycle, ranging from larger individual precipitation events to more extreme multiyear droughts, has the potential to cause widespread alterations in ecosystem structure and function. With evidence that the incidence of extreme precipitation years (defined statistically from historical precipitation records) is increasing, there is a clear need to identi...

Patterning PDMS using a combination of wet and dry etching

PDMS films of 10 μm thickness can be patterned within 30 min by combining dry etching to achieve substantially vertical sidewalls with wet etching to achieve high etch rates and to protect the underlying substrate from attack. Dry etching alone would have taken 5 h, and wet etching alone would produce severe undercutting. In addition, using either technique alone produces undesirable surface mo...