Antibacterial activity of porous anodized copper

This study was carried out to synthesize 1D inorganic nanostructure using an electrochemical method without any template and additives. Copper foils were anodized in a KOH bath and were tested for their antibacterial performance. After anodizing, the obtained samples were characterized by scanning electron microscopy (SEM) and X-ray diffraction (XRD) to determine the corresponding morphology and crystal structure, respectively. Finally, the antibacterial activity of the samples against both E. coli and S. aureus was tested by agar diffusion test. The typical porous surfaces were realized in all samples. These micropores may be beneficial to cell attachment. The morphology of the anodized copper exhibited when the concentration of OH− kept on going up, micropores and simultaneously nanoparticles were formed on the surface. By increasing the concentration of KOH, the water contact angle with anodized Cu foil varied within the range of 65.4 to 89.7°. Parent copper foil did not show antibiotic activity. The anodized copper exhibited acceptable antibacterial activities. The antibacterial action was the same for anodized copper at different concentration of OH−, which had nothing to do with the concentration of KOH electrolyte. The obtained results indicated that the porous copper could be employed to improve antibacterial activities of pure copper to meet the needs of bioactive surfaces.