Surface Modification of a PCB Substrate for Better Adhesion of Inkjet Printed Circuit Structures

The robustness and service life of inkjet printed electronic circuit structures are highly influenced by the state of the interface between these structures and the substrate. In the case of polymeric substrate materials, surface modification is necessary to realise a favourable interface, as these materials are generally not very receptive to chemical bond formation with the deposited ink. This paper deals with the surface modification of a high frequency laminate (substrate) using two different techniques to improve interfacial adhesion. The techniques deployed are CF4/O2 based plasma treatment and micro structuring using pulsed laser. The plasma treatment parameters were varied systematically using a statistical design of experiments. Substrates with varying surface characteristics, resulting from different plasma treatment parameters, were subjected to post-processing steps including surface energy and surface roughness measurements. Similarly, the influence of laser treatment parameters on surface characteristics of the substrate was also studied in detail. The outcomes of these two surface modification techniques are discussed in this paper.