Faster simulations of step bunching during anisotropic etching: formation of zigzag structures on Si(1 1 0)
نویسندگان
چکیده
We propose that the formation of zigzag structures on Si(1 1 0) during anisotropic etching is mainly a result of the formation of inhomogeneous regions in the etchant due to diffusion phenomena. In the same way as the presence of these etchant inhomogeneities results in step bunches on miscut (1 1 1) surfaces, it results in zigzags on the (1 1 0) surface. To support this proposal, we present an incremental activity monitoring (IAM) method for the simulation of step bunching using a kinetic Monte Carlo scheme. For stepped (1 1 1) surfaces, comparison with a previous step density monitoring (SDM) method shows that IAM is typically faster by one order of magnitude and is well suited for the simulation of step bunching. By applying IAM to (1 1 0), the formation of zigzag structures can be simulated, strongly suggesting that the morphology of this surface is dominated by the formation of inhomogeneous regions close to the surface in the etchant phase. (Some figures in this article are in colour only in the electronic version)
منابع مشابه
An atomistic introduction to anisotropic etching
This review-oriented paper presents a simplified model of anisotropic etching of crystalline silicon for the three principal orientations (1 1 1), (1 1 0) and (1 0 0), including their vicinal surfaces. The model combines pit nucleation and step flow with micromasking and diffusion phenomena in order to explain the major morphologic features and their changes with concentration. It also qualitat...
متن کاملSuppression of 3C-Inclusion Formation during Growth of 4H-SiC Si-Face Homoepitaxial Layers with a 1° Off-Angle
We grew epitaxial layers on 4H-silicon carbide (SiC) Si-face substrates with a 1° off-angle. The suppression of 3C-inclusion formation during growth at a high C/Si ratio was investigated, because a growth technique with a high C/Si ratio is needed to decrease residual nitrogen incorporation. 3C inclusions were generated both at the interface between the substrate and epitaxial layer, and during...
متن کاملDrift-Induced Step Instabilities Due to the Gap in the Diffusion Coefficient
Masahide Sato,∗ Makio Uwaha, and Yukio Saito Information Media Center of Kanazawa University, Kakuma-cho, Kanazawa 920-1192, Japan Department of Physics, Nagoya University, Furo-cho, Chikusa-ku, Nagoya 464-8602, Japan Department of Physics, Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama 223-8522, Japan (Dated: April 28, 2004) Abstract On a Si(111) vicinal face near the structural transiti...
متن کاملTwo-Layer Microstructures Fabricated by One-Step Anisotropic Wet Etching of Si in KOH Solution
Anisotropic etching of silicon in potassium hydroxide (KOH) is an important technology in micromachining. The residue deposition from KOH etching of Si is typically regarded as a disadvantage of this technology. In this report, we make use of this residue as a second masking layer to fabricate two-layer complex structures. Square patterns with size in the range of 15–150 μm and gap distance of ...
متن کاملConvex Corner Undercutting of {100} Silicon in Anisotropic KOH Etching: The New Step-Flow Model of 3-D Structuring and First Simulation Results
In this paper, the mechanism of convex corner (CC) undercutting of Si 100 in pure aqueous KOH solutions is revisited by proposing the step-flow model of 3-D structuring as a proper description of the observed phenomena. The basic idea is to conceive the Si 100 anisotropic etching process, on the atomic scale, as a “peeling” process of terraced {111} planes at 110 oriented steps to understand al...
متن کامل