Development of Ultrasonic Flip Chip Bonding Technology
نویسندگان
چکیده
Millimeter wave radars have been developed and marketed for the purpose of reduction in deaths in traffic accidents and traffic congestion. However, the millimeter wave radars need to be cheaper to be used more widely. In order to make the radars cheaper, we developed a new MMIC (Monolithic Microwave IC) structure and bonding technology, focusing on reducing costs of RF-modules. This article describes the new technology of bonding the MMIC to a resin substrate, and analyzing technology of MMIC and its bonded conditions. Abstract Motoaki TANI Hiromichi WATANABE Akihiko NISHIMURA Shigetaka KACHI Nobuhisa KATADA Shinichi SUGIURA
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