From (Au5Sn + AuSn) physical mixture to phase pure AuSn and Au5Sn intermetallic nanocrystals with tailored morphology: digestive ripening assisted approach.

نویسندگان

  • Neha Arora
  • Balaji R Jagirdar
چکیده

Here we present digestive ripening facilitated interatomic diffusion for the phase controlled synthesis of homogeneous intermetallic nanocrystals of Au-Sn system. Au and Sn metal nanoparticles synthesized by a solvated metal atom dispersion (SMAD) method are employed as precursors for the fabrication of AuSn and Au5Sn which are Au-rich Au-Sn intermetallic nanocrystals. By optimizing the stoichiometry of Au and Sn in the reaction mixture, and by employing growth directing agents, the formation of phase pure intermetallic AuSn and Au5Sn nanocrystals could be realized. The as-prepared Au and Sn colloidal nanoparticles and the resulting intermetallic nanocrystals are thoroughly characterized by powder X-ray diffraction, transmission electron microscopy (TEM and STEM-EDS), and optical spectroscopy. The results obtained here demonstrate the potential of solution chemistry which allows synthesizing phase pure Au-Sn intermetallics with tailored morphology.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Au5Sn intermetallic nanocrystals with tailored morphology: digestive ripening assisted approach

Please note that technical editing may introduce minor changes to the text and/or graphics, which may alter content. The journal’s standard Terms & Conditions and the Ethical guidelines still apply. In no event shall the Royal Society of Chemistry be held responsible for any errors or omissions in this Accepted Manuscript or any consequences arising from the use of any information it contains. ...

متن کامل

Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications

As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic Au-Sn alloy was used in this study. Using a coelectroplating process, it was possible to plate the Au-Sn solder directly onto a wafer at or near the eutectic composition from a single solution. Two distinct phases, Au5Sn and AuSn, were deposited at a composition of 30at.%Sn...

متن کامل

AuSn20 Eutectic Electrodeposition through Alternative Complexing of Pyrophosphoric Acid: Insights from Electrochemical and DFT Methods

Eutectic AuSn20 solder is an important material for electronic packaging technology due to its superior mechanical and thermal conductive properties. In this work, AuSn20 alloy films are prepared via the electrodeposition method for the first time. The electrodeposition is cost-effective with improved control over the alloy content when compared to traditional powdered metallurgy methods. Pyrop...

متن کامل

A strategy for fabricating nanoporous gold films through chemical dealloying of electrochemically deposited Au-Sn alloys.

We report a novel strategy for the fabrication of nanoporous gold (NPG) films. The fabrication process involves the electrodeposition of a gold-tin alloy, followed by subsequent chemical dealloying of tin. Scanning electron microscopy (SEM) images show a bicontinuous nanoporous structure formed on the substrates after chemical dealloying. Energy dispersive x-ray (EDX) analysis indicates that th...

متن کامل

In situ heating transmission electron microscopy observation of nanoeutectic lamellar structure in Sn-Ag-Cu alloy on Au under-bump metallization.

We investigated the microstructural evolution of Sn(96.4)Ag(2.8)Cu(0.8) solder through in situ heating transmission electron microscopy observations. As-soldered bump consisted of seven layers, containing the nanoeutectic lamella structure of AuSn and Au₅Sn phases, and the polygonal grains of AuSn₂ and AuSn₄, on Au-plated Cu bond pads. Here, we found that there are two nanoeutectic lamellar lay...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:
  • Physical chemistry chemical physics : PCCP

دوره 16 23  شماره 

صفحات  -

تاریخ انتشار 2014