The Effect of Thermal Annealing on the Adherence of Al203-Films Deposited by Low-Pressure, Metal-Organic, Chemical-Vapor Deposition on AISI
نویسنده
چکیده
Thin alumina films, deposited at 280~ by low-pressure, metal-organic, chemical-vapor deposition on stainless steel, type AISI 304, were annealed at 0.17 kPa in a nitrogen atmosphere for 2, 4, and 17 hr at 600, 700, and 800~ The effect of the annealing process on the adhesion of the thin alumina films was studied using a scanning-scratch tester, type SST-IO1, developed by Shimadzu. The best mechanical properties were obtained with unannealed samples. After thermal annealing the critical load decreased, proportional to annealing time and/or temperature. This effect was probably due to the presence of a high thermal stress and to preferential segregation of sulfur near the oxidealloy interface.
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