Spontaneous oxide reduction in metal stacks

نویسندگان

  • Wentao Qin
  • Alex A. Volinsky
  • Dennis Werho
  • N. David Theodore
  • Mike Kottke
  • Chandra Ramiah
چکیده

Aluminum and copper interconnects are widely used for microelectronic applications. A problem can arise when interfacial oxides are present. Such oxides can significantly degrade device performance by increasing electrical resistance. This paper describes analyses of interfacial oxide layers found in Al/Ta and Ta/Cu metal stacks. The analyses were performed through transmission electron microscopy (TEM). The data indicated that the interfacial oxides resulted from spontaneous reductions; that is, Al spontaneously reduced Ta2O5 to form Al2O3, while Ta spontaneously reduced Cu oxide to form Ta2O5. D 2004 Elsevier B.V. All rights reserved. PACS: 82.65.Dp; 68.35; 73.90.+f; 61.16.Bg; 82.80.Pv

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تاریخ انتشار 2004