Modelling, manufacture and test of a microchannel cooling plate for microelectronics packaging
نویسندگان
چکیده
The modelling, simulation, fabrication and testing of a microchannel cooling plate are described in this article. The cooling component is to be used in microelectronic packaging applications. The nickelbased micro-channel cooling plate is fabricated on a glass substrate using a two-layer electroforming process borrowed from UV-LIGA. Forced convection of air or liquid is scheduled for this microchannel plate. The cooling plate was tested using a custommade test rig to measure pressure head as a function of mass flow rate. Hydraulic performance of the cooling plate is presented.
منابع مشابه
Advances in mesoscale thermal management technologies for microelectronics
This paper presents recent advances in a number of novel, high-performance cooling techniques for emerging electronics applications. Critical enabling thermal management technologies covered include microchannel transport and micropumps, jet impingement, miniature flat heat pipes, transient phase change energy storage systems, piezoelectric fans, and prediction of interface contact conductance....
متن کاملPackaging Design & Manufacture of High Temperature Electronics Module for 225oC Applications utilizing Hybrid Microelectronics Technology
Many downhole instrumentation tools manufacture today utilizing organic material packaging technology for producing electronic modules. Such approach with organic PCB, standard packaged discrete semiconductor and SMT-type passive components has limited the device operating temperature range in 177oC area. An alternative packaging approach is to utilize Hybrid Microelectronics Technology to incr...
متن کاملStacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics Devices
for their time and efforts in reviewing the proposals and dissertations and their helpful advices. My sincere gratitude goes to DARPA and Intel Corporation for their financial support. I would also like to thank the University of Maryland College Park for their financial support in the form of Graduate School Fellowship. I would also like to take this opportunity to express my appreciations and...
متن کاملMetastable helium Bose-Einstein condensate with a large number of atoms
We have produced a Bose-Einstein condensate of metastable helium He containing over 1.5 107 atoms, which is a factor of 25 higher than previously achieved. The improved starting conditions for evaporative cooling are obtained by applying one-dimensional Doppler cooling inside a magnetic trap. The same technique is successfully used to cool the spin-polarized fermionic isotope He , for which the...
متن کاملActive Packaging for Food Applications - A Review
The purpose of food packaging is to preserve the quality and safety of the food it contains from the time of manufacture to the time it is used by the consumer. Recently, the demand for safe and high quality foods, as well as changes in consumer preferences have led to the development of innovative and novel approaches in food packaging technology. One such development is the active food packag...
متن کامل