High Fin Width Mosfet Using Gaa Structure

نویسنده

  • Ramanuj Mishra
چکیده

This paper describes the design and optimization of gate-all-around (GAA) MOSFETs structures. The optimum value of Fin width and Fin height are investigated for superior subthreshold behavior. Also the performance of Fin shaped GAA with gate oxide HfO2 are simulated and compared with conventional gate oxide SiO2 for the same structure. As a result, it was observed that the GAA with high K dielectric gate oxide has more possibility to optimize the Fin width with improved performance. All the simulations are performed on 3-D TCAD device simulator.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Multi-gate Mosfet Structures with High-k Dielectric Materials

Multi-gate MOSFETs has shown better results in subthreshold performances. The replacement of SiO2 by high-k dielectric can fulfill the requirements of Multi-gate MOSFETS with scaling trend in device dimensions. The advancement in fabrication technology has also boosted the use of different high K dielectric materials as oxide layer at different places in MOSFET structures. One of the most impor...

متن کامل

High-performance III-V MOSFET with nano-stacked high-k gate dielectric and 3D fin-shaped structure

A three-dimensional (3D) fin-shaped field-effect transistor structure based on III-V metal-oxide-semiconductor field-effect transistor (MOSFET) fabrication has been demonstrated using a submicron GaAs fin as the high-mobility channel. The fin-shaped channel has a thickness-to-width ratio (TFin/WFin) equal to 1. The nano-stacked high-k Al2O3 dielectric was adopted as a gate insulator in forming ...

متن کامل

Technology of FinFET for High RF and Analog/Mixed-Signal Performance Circuits

In this paper, we discuss the process, layout and device technologies of FinFET to obtain high RF and analog/mixed-signal performance circuits. The fin patterning due to Side-wall transfer (SWT) technique is useful to not only fabricate narrow fin line but also suppress the fin width variation comparing with ArF and EB lithography. The H2 annealing after Si etching is useful for not only to imp...

متن کامل

Impact of Fin Dimensions and Gate DielectricThickness on the Static Power Dissipation of 6T- FinFET SRAM Cell

The Triple gate FinFET architecture has emerged as a viable contender for the ultimate scalability of CMOS devices. FinFET structure offers better control over device leakage currents than the conventional bulk MOSFET structure. In this paper, we present the 6 transistor (6T) SRAM cell implementation using the 22 nm gate length FinFET devices modeled using a 3-D device simulator. The performanc...

متن کامل

First Experimental Demonstration of Gate-all-around III-V MOSFETs by Top-down Approach

The first inversion-mode gate-all-around (GAA) III-V MOSFETs are experimentally demonstrated with a high mobility In0.53Ga0.47As channel and atomic-layer-deposited (ALD) Al2O3/WN gate stacks by a top-down approach. A wellcontrolled InGaAs nanowire release process and a novel ALD high-k/metal gate process has been developed to enable the fabrication of III-V GAA MOSFETs. Well-behaved on-state an...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2012