Optimization of Package Saw Parameters Using Full Factorial Design in Qfn Packages

Quad Flat No-lead (QFN) presents an excellent example of a complex substrate composed of both ductile (copper) and brittle (plastic molding compound) materials, showing clear trends of reduction in package size and the combination ductile and brittle materials in the same sawing process which creates real challenges in term of sawing quality, blade life and throughput. This paper discussed on the effect of different blade rotation and cutting speed process parameters in package saw singulation. The objective of this study is to screen the effect on the output quality by increasing the throughput using existing blade. The design of experiment on singulating processes is evaluated for this study to get the optimal parameters for the process. The type of sawing process used was the single-pass tape saw method. The package shifting and burr level analysis were measured by using Smartscope Optical Gaging. The results showed that at higher cutting speed and lower blade rotation, less chipping, burr level and side smear were observed.