Eye Diagram Construction

NOTICE OF DISCLAIMER: Xilinx is providing this design, code, or information "as is." By providing the design, code, or information as one possible implementation of this feature, application, or standard, Xilinx makes no representation that this implementation is free from any claims of infringement. You are responsible for obtaining any rights you may require for your implementation. Xilinx expressly disclaims any warranty whatsoever with respect to the adequacy of the implementation, including but not limited to any warranties or representations that this implementation is free from claims of infringement and any implied warranties of merchantability or fitness for a particular purpose. Summary On-die termination (ODT) promises higher signaling rates for printed circuit board (PCB) interchip interfaces through improved signal integrity. However, when using ODT, there is sometimes an associated power penalty. This application note explains the reason for the power penalty and suggests a simulation technique for comparing the signal integrity and power dissipation of internally and externally terminated versions of an interface. The termination architecture that is most appropriate to a product’s requirements can be chosen intelligently in advance, thus saving valuable engineering design cycles.