Graphene reknits its holes.

Graphene "microdrums" on a freestanding perforated thin membrane for high sensitivity MEMS pressure sensors.

We present a microelectromechanical system (MEMS) graphene-based pressure sensor realized by transferring a large area, few-layered graphene on a suspended silicon nitride thin membrane perforated by a periodic array of micro-through-holes. Each through-hole is covered by a circular drum-like graphene layer, namely a graphene "microdrum". The uniqueness of the sensor design is the fact that int...

Electronic strengthening of graphene by charge doping.

Graphene is known as the strongest 2D material in nature, yet we show that moderate charge doping of either electrons or holes can further enhance its ideal strength by up to ~17%, based on first-principles calculations. This unusual electronic enhancement, versus conventional structural enhancement, of the material's strength is achieved by an intriguing physical mechanism of charge doping cou...

Bulk preparation of holey graphene via controlled catalytic oxidation.

Structural manipulation of the two dimensional graphene surface has been of significant interest as a means of tuning the properties of the nanosheets for enhanced performance in various applications. In this report, a straightforward and highly scalable method is presented to prepare bulk quantities of "holey graphenes", which are graphene sheets with holes ranging from a few to tens of nm in ...

Effective mass of electrons and holes in bilayer graphene: Electron-hole asymmetryand electron-electron interaction

Fabrication of graphene with CuO islands by chemical vapor deposition.

Graphene prepared on Cu foil by chemical vapor deposition was studied as a function of post growth cooling conditions. CuO islands embedded in the graphene film were discovered and studied by scanning electron microscopy, atomic force microscopy, and X-ray photoemission spectroscopy. It is shown that nanostructured holes can be formed within a graphene film by reduction using hydrogen cooling i...