Dielectric and Conductor Roughness Models Identification for Successful PCB and Packaging Interconnect Design up to 50 GHz

Meaningful interconnect design and compliance analysis must start with the identification of broadband dielectric and conductor roughness models. Such models are not available from manufacturers and the model identification is the most important element of successful interconnect design for link paths with 10-50 Gbps and higher data rates. Electromagnetic analysis of interconnects without such models may be simply not accurate. Overview of broadband dielectric and conductor roughness models for PCB and packaging interconnect problems is provided in the paper. Theory of model identification with generalized modal S-parameters and separation of dielectric and conductor dispersion and loss effects is described. Practical examples of successful dielectric and conductor roughness model identification up to 50 GHz are