Localized Heating, Melting, and Drilling of Silicon
نویسنده
چکیده
The microwave drill [1] is used in this study for a localized heating of silicon plates, up to the melting point. The paper presents the experimental setup, including the heating device and the temperature measurement techniques. The experimental results show a higher rate of local temperature increase compared to other known methods. This heating method enables localized thermal processes, jointing, welding, and even drilling of >0.1-mm diameter holes in silicon for MEMS applications.
منابع مشابه
Title Influence of substrate heating on hole geometry and spatter area in femtosecond laser drilling of silicon
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