ECM - 0907 IPQ.indd

n Part 2 of this article (August 2007), we described multipoint (or common-type) supple mental grounding and bonding between the T(M)GB [notation used here to indicate that the bar may be either the TMGB or TGB, depending on the location within the building] and the telecommunications and information technology equipment (ITE) systems. This installment will focus on the single-point (or insulated-type) supplemental grounding and bonding application and its relationship to equipotential.