Channel Constrained Metalization Patterning of Reflective Backplane Electrodes for Liquid Crystal-on-Silicon Displays
نویسندگان
چکیده
Channel Constrained Metalization (CCM), which employs photoresist patterning to confine electroless metal deposition to selected regions, is an inexpensive alternative to metal sputtering or evaporation. Using CCM we deposited arrays of square nickel electrodes up to one micron in thickness and between 11 um and 44 jxm on the side. Gaps between the electrodes ranging from 1 um to 4 pm were successfully patterned. In preliminary experiments, we have already achieved a reflectivity of up to 94% and an r.m.s. surface roughness of 3.3 nm evaluated on a pixel size (20 pm square) area.
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