Integrated on a Planar Fashionable Circuit Board

Recently, several research results have been reported on the integration of electronics with textiles such as the wearable computer and e-textiles [1-3]. Most of the previous works were based mainly on conducting threads, yarns, and woven fabrics to implement the interconnections, like the wearable motherboard [4]. For the integration of the IC with fabric, they placed the silicon chip on a flexible plastic board and then integrated the plastic board on the fabric [1-4]. However, the plastic board is harder than fabric and may generate a stiff feeling in the clothes, not withstanding the long integration process. In addition, its durability is poor due to its different hardness and temperature expansion coefficient.