Towards micro-assembly of hybrid MOEMS components on reconfigurable silicon free-space micro-optical bench

The 3D integration of hybrid chips is a viable approach for the micro-optical technologies to reduce the costs of assembly and packaging. In this paper a technology platform for the hybrid integration of MOEMS components on a reconfigurable free-space silicon micro-optical bench is presented. In this approach a desired optical component (e.g. micromirror, microlens) is integrated with removable and adjustable silicon holder which can be manipulated, aligned and fixed in the precisely etched rail of the silicon baseplate by use of robotic micro-assembly station. An active-based gripping system allows modification of the holder position on the baseplate with nanometre precision. The fabrication processes of the micromachined parts of the micro-optical bench, based on bulk micromachining of standard silicon wafer and SOI wafer, are described. The successful assembly of the holders, equipped with micromirror and refractive glass ball microlens, on the baseplate rail is demonstrated. Short title: Micro-assembly of MOEMS on reconfigurable MOB PACS numbers: 85.85.+j; 87.85Uv