Electrical Properties of Plasma-assisted Cvd Deposited Thin Silicon Oxynitride Films

نویسندگان

  • A. Szekeres
  • S. Simeonov
  • A. Gushterov
  • T. Nikolova
  • F. Hamelmann
  • U. Heinzmann
چکیده

The electrical properties of MIS structures with silicon oxynitride films, deposited at 200 C in a RF-plasma CVD reactor using Si(OC2H5)4 (TEOS) as a precursor and nitrogen as the gas ambient have been studied. The analysis of the capacitance-voltage and current–voltage characteristics has shown that a larger DC bias yields larger densities of dielectric charge and interface traps in the growing films, and therefore, a lower specific resistivity of the SiOxNy films.

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تاریخ انتشار 2005